CY7C1463V33
CY7C1463V33 Description
1M x 36/2M x 18/512K x 72 Flow-Thru SRAM with NoBL™ Architecture
CY7C1463V33 Vendor
Cypress
CY7C1463V33 Categories
CY7C1463V33 Features
  • Zero Bus LatencyTM, no dead cycles between Write and Read cycles
  • Supports 133-MHz bus operations
  • 1M × 36/2M × 18/512K × 72 common I/O
  • Fast clock-to-output times
    • 6.5 ns (for 133-MHz device)
    • 7.5 ns (for 117-MHz device)
  • Single 3.3V –5% and +5% power supply VDD
  • Separate VDDQ for 3.3V or 2.5V
  • Clock Enable (/CEN) pin to suspend operation
  • Burst Capability–linear or interleaved burst order
  • Available in 119-ball bump BGA, 165-ball FBGA, and 100-pin TQFP packages (CY7C1461V33 and CY7C1463V33). 209-ball FBGA package for CY7C1465V33
CY7C1463V33 Description

    The CY7C1461V33, CY7C1463V33 and CY7C1465V33 SRAMs are designed to eliminate dead cycles when transitions from Read to Write or vice versa. These SRAMs are optimized for 100% bus utilization and achieve Zero Bus Latency. They integrate 1,048,576 × 36/2,097,152 × 18/ 524,288 × 72 SRAM cells, respectively, with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. The Synchronous Burst SRAM family employs high-speed, low-power CMOS designs using advanced single layer polysilicon, threelayer metal technology. Each memory cell consists of six transistors.

    All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, depth-expansion Chip Enables (/CE1, CE2 and /CE3), cycle start input (ADV//LD), Clock Enable (/CEN), Byte Write Selects (/BWSa, /BWSb, /BWSc, /BWSd, /BWSe, /BWSf, /BWSg, /BWSh), and Read-Write control (/WE). /BWSc and /BWSd apply to CY7C1461V33 and CY7C1465V33 only. /BWSe, /BWSf, /BWSg and /BWSh apply to CY7C1465V33 only

    A Clock Enable (/CEN) pin allows operation of the CY7C1461V33, CY7C1463V33, and CY7C1465V33 to be suspended as long as necessary. All synchronous inputs are ignored when (/CEN) is high and the internal device registers will hold their previous values.

    There are three Chip Enable (/CE1, CE2, /CE3) pins that allow the user to deselect the device when desired. If any one of these three are not active when ADV//LD is low, no new memory operation can be initiated and any burst cycle in progress is stopped. However, any pending data transfers (READ or WRITE) will be completed. The data bus will be in high impedance state two cycles after chip is deselected or a Write cycle is initiated.

    The CY7C1461V33, CY7C1463V33 and CY7C1465V33 have an on-chip two-bit burst counter. In the burst mode, CY7C1461V33, CY7C1463V33 and CY7C1465V33 provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the MODE input pin. The MODE pin selects between linear and interleaved burst sequence. The ADV//LD signal is used to load a new external address (ADV//LD = LOW) or increment the internal burst counter (ADV//LD = HIGH)

    Output Enable (/OE) and burst sequence select (MODE) are the asynchronous signals. /OE can be used to disable the outputs at any given time. ZZ may be tied to LOW if it is not used.

    Four pins are used to implement JTAG test capabilities. The JTAG circuitry is used to serially shift data to and from the device. JTAG inputs use LVTTL/LVCMOS levels to shift data during this testing mode of operation.

ChipCatalog.com - Your Source of Information About Electronic Components